The introduction of these higher-core-count models raises questions about their potential gaming performance, as AMD’s 8-core 3D V-Cache processors have historically dominated in gaming benchmarks, hitting what many consider the “sweet spot” for gaming performance. While more cores generally benefit productivity tasks and multi-threaded workloads, their impact on gaming has been less pronounced.

Performance Expectations

A recent report by VideoGamer shed light on what enthusiasts can expect from these upcoming Ryzen 9 X3D chips. The publication obtained comments from Martijn Boonstra, a product and business development manager at AMD. Boonstra indicated that the gaming performance of the Ryzen 9 9950X3D and 9900X3D will be comparable to that of the Ryzen 7 9800X3D, stating:

“Our new chips will provide similar overall gaming performance to the Ryzen 7 9800X3D. There will be some games that perform a bit better—if the game engine utilizes more cores and threads—and some games will perform a little worse (if the game engine favors a single CCD configuration), but on the whole, the experience is comparable.”

This suggests that the higher core counts of the Ryzen 9 X3D models may offer benefits in games optimized for multi-threaded performance but will not uniformly outperform the 8-core Ryzen 7 9800X3D in all scenarios.

Pricing and Availability

While Boonstra refrained from disclosing specific pricing details for the upcoming processors, he mentioned that AMD plans to announce final pricing closer to launch. The Ryzen 7 9800X3D currently retails for $479, though availability remains inconsistent. It remains to be seen how AMD will position the Ryzen 9 9950X3D and 9900X3D within their existing product lineup and whether they will carry a significant price premium.

Market Position

AMD’s 3D V-Cache technology has proven to be a key differentiator in gaming performance, and the Ryzen 7000X3D series is marketed toward gamers and creators seeking high-performance solutions. Boonstra emphasized this positioning, stating that the new chips are designed to appeal to users across different platforms:

“Ryzen 9000X3D Series desktop processors are perfect for gamers and content creators alike…whether you are already on the AM5 platform, on AM4 or another platform, these products are sure to impress.”

With the AM5 platform gaining traction and support for DDR5 memory and PCIe 5.0 becoming more widespread, AMD is likely aiming to attract upgraders and new adopters as part of its strategy to maintain a competitive edge in the desktop CPU market.

Our Verdict

The Ryzen 9 9950X3D and 9900X3D are shaping up to be intriguing additions to AMD’s lineup, particularly for users who require additional cores for demanding workloads alongside gaming. However, the lack of a clear performance uplift over the Ryzen 7 9800X3D in gaming may temper expectations. More details, including pricing and official benchmarks, are expected as the March release window approaches.

Sources: VideoGamer, Tom’s Hardware, Wccftech

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Technical Overview

The Ryzen 9 9950X3D features 16 cores and 32 threads, while the Ryzen 9 9900X3D offers 12 cores and 24 threads. Both processors use a dual-CCD (Core Complex Die) design, similar to the Ryzen 9 7000X3D series. However, AMD has made significant improvements in how the 3D V-Cache is implemented. Unlike the previous generation, the 3D V-Cache in the “Zen 5” architecture is positioned below the CCD rather than above it. This design change enables the CCD with 3D V-Cache to achieve clock speeds comparable to the CCD without it. This is a notable improvement over earlier models, where the presence of 3D V-Cache often led to slightly reduced clock speeds.

To further optimize performance, AMD has refined its OS scheduler software. The updated scheduler ensures that productivity applications can efficiently utilize both CCDs, while gaming workloads are directed to the CCD equipped with 3D V-Cache. This selective utilization aims to maximize performance across diverse tasks.

Specifications

The Ryzen 9 9950X3D has a base clock of 4.30 GHz and boosts up to 5.70 GHz, with a thermal design power (TDP) of 170 W. This marks a significant improvement in boost frequency compared to the Ryzen 7 9800X3D, which maxes out at 5.20 GHz. AMD positions the 9950X3D as the fastest gaming desktop processor in its lineup.

The Ryzen 9 9900X3D, on the other hand, offers a base clock of 4.40 GHz and a maximum boost clock of 5.50 GHz. While its CCD with 3D V-Cache has only six cores, its high clock speeds make it an attractive option for users seeking balanced performance in gaming and productivity tasks.

Performance Benchmarks

AMD reports that the Ryzen 9 9950X3D is, on average, 8% faster than its predecessor, the 7950X3D, in gaming workloads. It also outperforms the Intel Core Ultra 9 285K by 20% in gaming tests conducted across 40 titles. For productivity workloads, the 9950X3D delivers 13% higher performance than the 7950X3D and is 10% faster than the Core Ultra 9 285K in a range of benchmarked tasks.

AMD has yet to release first-party performance data for the Ryzen 9 9900X3D, but based on its specifications, it is expected to compete closely with the 9800X3D in gaming and deliver faster performance in multi-threaded productivity workloads than non-X3D Ryzen 9000 processors.

Market Position and Availability

AMD asserts that the Ryzen 9 9950X3D is the “world’s best processor” for both gaming and productivity, a claim that underscores its aim to maintain a competitive edge against Intel’s latest offerings. The 9900X3D is expected to appeal to users seeking a more affordable yet high-performance option within the Ryzen 9000X3D lineup.

Both processors are scheduled for release in Q1 2025, with further details on pricing and availability expected to follow in the coming months. These additions to AMD’s portfolio demonstrate the company’s commitment to advancing desktop processor technology, leveraging innovations in cache design and microarchitecture to deliver higher performance and efficiency.

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RTX 5080 Pricing: Marginal Increase Over Predecessor

According to the screenshot, the RTX 5080 is priced at 9,999 RMB, which translates to approximately $1,370. For comparison, its predecessor, the RTX 4080, was launched with an MSRP of 9,499 RMB in China. This represents a modest increase of about 5 percent. However, buyers should note that Chinese pricing includes a 13 percent value-added tax (VAT), which affects the conversion to international pricing. Despite the relatively small increase, this price point keeps the RTX 5080 within reach of enthusiasts who typically target high-end GPUs.

RTX 5090: A Dramatic Price Hike

The RTX 5090, on the other hand, shows a dramatic jump in pricing. The leaked MSRP for the flagship GPU is 18,999 RMB, roughly $2,600. This marks a staggering 46 percent increase over the RTX 4090’s launch price of 12,999 RMB. If these numbers hold true, the RTX 5090 will become one of the most expensive consumer GPUs ever released, raising questions about how the market will respond to such a premium price point.

Implications and Speculation

While the price of the RTX 5080 suggests NVIDIA is aiming to keep its mid-tier options competitive, the RTX 5090’s price hike could indicate significant advancements in hardware performance and capabilities. However, such a steep increase might alienate some buyers or push more consumers toward alternatives, including previous-generation GPUs or competitive offerings from AMD and Intel.

It’s worth noting that leaked pricing information should be approached cautiously. Regional differences, currency fluctuations, and local taxes can create variations in final retail prices. Furthermore, leaks are not always reflective of the final MSRP, as companies often make adjustments leading up to official launches.

Lower-Tier RTX 5000 Cards and Launch Timeline

In a follow-up to the initial leak, @wxnod shared another image that includes an expected timeline for the release of lower-tier RTX 5000-series GPUs. The information appears to be sourced from a video and outlines potential launch months for other cards in the series. Although the exact dates were not included, the RTX 5090 and RTX 5080 are expected to debut in January 2024, with additional models likely following shortly thereafter.

Industry and Consumer Reactions

If accurate, the pricing and release schedule could influence how NVIDIA’s latest GPUs are perceived in a competitive market. The significant price hike for the RTX 5090 might drive demand for used RTX 4090 units or push budget-conscious consumers toward the RTX 5080. Additionally, the premium pricing could benefit competitors, who may capitalize on NVIDIA’s strategy by offering more affordable alternatives.

As the GPU market remains a critical segment for gaming, content creation, and professional applications, the RTX 5000-series launch will likely shape industry dynamics in the coming months. However, until official announcements are made, these leaked details remain speculative and should be treated as such.

Stay tuned for more updates as NVIDIA moves closer to unveiling its next generation of graphics cards.

Sources: @wxnod, @harukaze5719

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The processor features AMD’s refined cache architecture, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache, totaling 128 MB of L3 cache, alongside an additional 16 MB of L2 cache. Unlike its predecessor, the Ryzen 9 7950X3D, the new design incorporates a revamped CCD stacking method. The redesigned configuration positions the CCD above the cache, interfacing directly with the STIM (Soldered Thermal Interface Material) and IHS (Integrated Heat Spreader). This improvement eliminates thermal constraints that previously limited clock speeds on X3D chips, enabling higher operational frequencies.

The Ryzen 9 9950X3D features an asymmetric cache distribution across its dual CCDs. One CCD includes 32 MB of standard L3 cache paired with an additional 64 MB of stacked 3D V-Cache, while the second CCD contains a standard 32 MB L3 cache. This design allows the processor to optimize performance for gaming and productivity workloads while maintaining an efficient thermal profile.

The processor achieves a maximum boost clock of 5.65 GHz across both CCDs, matching the performance of non-X3D variants. Maintaining a 170 W TDP, the Ryzen 9 9950X3D demonstrates improved thermal efficiency despite the additional cache layer. AMD’s software-based OS scheduler remains a crucial component of the design, ensuring gaming workloads are directed to the CCD equipped with 3D V-Cache for optimal performance.

Preliminary performance leaks suggest that the Ryzen 9 9950X3D matches the base Ryzen 9 9950X in Cinebench R23 scores for both single-threaded and multi-threaded benchmarks. This is a notable improvement compared to the Ryzen 9 7950X3D, which exhibited lower performance than its non-X3D counterpart due to frequency limitations imposed by its thermal constraints. These results indicate AMD has successfully mitigated the challenges associated with integrating 3D V-Cache on high-core-count processors.

AMD’s plans for the Zen 5 X3D lineup include the Ryzen 9 9950X3D as well as the 12-core Ryzen 9 9900X3D, both expected to launch in the first quarter of 2025. Full performance benchmarks, pricing, and additional details are anticipated at CES 2025, where AMD is expected to officially unveil the new processors. The event will also mark the debut of AMD’s next-generation RDNA 4 GPUs, further highlighting the company’s advancements in high-performance computing.

Sources: @94G8LA, via VideoCardz

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Expanding the Ryzen 9000X3D Family

On the CPU front, AMD is anticipated to expand its Ryzen 9000X3D lineup with high-core count models such as the Ryzen 9 9950X3D and Ryzen 9 9900X3D. These processors are expected to leverage the company’s cutting-edge 3D V-Cache technology to deliver enhanced gaming and multitasking performance. Alongside these high-end models, AMD is reportedly preparing to introduce power-efficient 65 W variants of its non-X3D Ryzen 9000 series processors, based on the “Zen 5” architecture. These models aim to offer an attractive value proposition for mainstream users, targeting potential buyers of Intel’s 65 W Core Ultra “Arrow Lake-S” processors.

Radeon RX 9000 Series Debut

On the gaming graphics front, AMD is set to unveil its next-generation Radeon RX 9000 series. Leading this lineup are the Radeon RX 9070 XT and RX 9070, which will be powered by the new “Navi 48” silicon and the RDNA 4 graphics architecture. These GPUs are expected to deliver significant performance and efficiency improvements over the previous generation, with enhancements aimed at both gamers and creators. The introduction of RDNA 4 is likely to include architectural upgrades that push performance-per-watt metrics further, ensuring AMD remains competitive in the high-performance GPU market.

Introduction of FSR 4 Technology

In addition to hardware announcements, AMD is expected to introduce FidelityFX Super Resolution (FSR) 4, the latest iteration of its performance enhancement technology for gaming. According to leaks, FSR 4 will build upon the features of FSR 3.x by integrating advanced upscaling techniques and frame-generation technology. Unlike its predecessors, FSR 4 is expected to incorporate new methods to improve visual fidelity and frame-generation accuracy. While specific details are yet to be confirmed, FSR 4 could mark a significant leap in gaming performance enhancement by delivering higher-quality visuals and smoother gameplay experiences.

Launch and Availability Timeline

Reports indicate that AMD’s announcements at CES 2025 will be followed by the hardware’s availability later in January. This timeline suggests that AMD is aiming to capitalize on the post-holiday tech market, providing gamers and PC enthusiasts with access to the latest CPUs and GPUs within weeks of their unveiling.

Industry Implications

The announcements expected from AMD at CES 2025 underscore the company’s commitment to advancing computing and graphics technologies. By expanding its Ryzen 9000X3D lineup, introducing power-efficient “Zen 5” CPUs, and debuting the Radeon RX 9000 series alongside FSR 4, AMD is signaling a strategy that emphasizes both performance leadership and value-driven innovation. As competition intensifies in the processor and graphics markets, AMD’s latest offerings are likely to play a crucial role in shaping the industry’s trajectory for the coming year.

Source: VideoCardz

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Cooling Solution and Compatibility

Intel’s 65 W Core Ultra 200-series models will reportedly be compatible with the company’s Laminar series fan-heatsinks, originally introduced with the 12th Gen Core “Alder Lake” processors. The new processors retain Socket LGA1851, which shares cooler compatibility with the older LGA1700 socket. This design decision simplifies the inclusion of existing cooling solutions, potentially reducing production complexity and cost.

The Core Ultra 9 65 W retail box is notably larger than others in the lineup, hinting at the inclusion of the high-capacity Laminar RH1 cooler. Designed for processors with elevated power demands, the RH1 features blue LED lighting and sufficient thermal performance to handle peak turbo power levels.

For the Core Ultra 7 and Core Ultra 5 65 W models, the boxes appear to have similar dimensions. These processors are likely to be paired with the Laminar RM1 cooler, which offers a balance of thermal performance and aesthetics. The RM1 features a thinner heatsink compared to the RH1 but includes an illuminated ring around the fan frame.

If Intel introduces a Core Ultra 3 model as part of this series, it may include the Laminar RS1 cooler. The RS1 is the most basic variant in the lineup, designed for entry-level processors and lacking any lighting elements. Its compact design and simpler build make it suitable for lower power consumption models.

Standard and “F” Variants

Images of the retail packaging show clear distinctions between the standard variants and the “F” variants of the 65 W processors. The standard models include integrated graphics, while the “F” models do not. The latter’s packaging is differentiated by slight design variations, making it easier for consumers to identify the specific features of the processors they are purchasing.

Visual Overview

The first three images highlight the retail boxes for the standard Core Ultra 9, Core Ultra 7, and Core Ultra 5 65 W models. These boxes emphasize the inclusion of cooling solutions and feature distinctive designs tailored to each processor tier. The fourth and fifth images focus on the “F” variants, which share similar dimensions and design elements with their standard counterparts but cater to users who do not require integrated graphics capabilities.

Anticipation for January Launch

The Core Ultra 200-series “Arrow Lake-S” processors represent Intel’s continued evolution in desktop performance. By including bundled cooling solutions and maintaining compatibility with existing sockets, Intel aims to deliver a more user-friendly and cost-effective experience for consumers. With the launch date set for January 2025, these processors are expected to offer significant competition in the mainstream desktop market.

Source: momomo_us (Twitter)

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Benchmark Revelations: A 4+4 Configuration

The PassMark result confirms that the Ryzen AI 7 350 features a 4+4 CPU core configuration, combining AMD’s Zen 5 and Zen 5c cores. This hybrid architecture aims to balance performance and efficiency, with the Zen 5 cores focusing on high-performance tasks and the Zen 5c cores emphasizing energy efficiency. This design aligns with AMD’s strategy of optimizing battery life and thermal performance, potentially positioning these APUs as a direct response to Qualcomm’s advancements in mobile processing.

A Downgrade in Integrated Graphics

One notable departure from tradition lies in the integrated GPU (iGPU) configuration. Historically, Ryzen 7 and Ryzen 9 mobile APUs have included high-performance Radeon -80M or -90M series iGPUs. However, the Ryzen AI 7 350 features the AMD Radeon 860M, a step down from its predecessors. The naming convention aligns the 860M more closely with iGPUs found in Ryzen 5 APUs, suggesting it may deliver less graphical performance compared to previous generations.

Early benchmarks support this hypothesis. A comparison between the Radeon 760M and the Radeon 860M on PassMark shows the latter lagging behind by an average of 9.1%. It is worth noting, however, that the data pool for the 860M is currently limited to a single result, so these figures should be interpreted with caution. The potential performance gap highlights AMD’s likely focus on reducing power consumption and heat output rather than maximizing graphics performance in this iteration.

Strategic Implications for AMD

The decision to prioritize energy efficiency over graphical prowess could mark a strategic pivot for AMD. By adopting the 4+4 hybrid architecture and scaling back the iGPU, the Ryzen AI Kraken Point APUs may cater to a market segment increasingly concerned with portability and battery longevity. This approach could broaden the appeal of AMD’s APUs, particularly for devices like ultra-thin laptops and entry-level gaming handhelds, where extended battery life is critical.

Broader Market Context

This development comes at a time when competition in the mobile processor space is intensifying. Qualcomm’s latest offerings, featuring advanced efficiency cores and integrated AI capabilities, have set a high bar for competitors. AMD’s decision to adopt a heterogenous core architecture and scale back the iGPU in the Ryzen AI 7 350 appears to be a calculated response, aimed at carving out a niche in the evolving landscape of portable computing.

Our Verdict

The Ryzen AI Kraken Point APUs, led by the Ryzen AI 7 350, represent a nuanced shift in AMD’s mobile processor strategy. While the reduced iGPU performance might raise eyebrows, the emphasis on efficiency and thermal management suggests a targeted approach to addressing the needs of modern thin-and-light laptops and gaming handhelds. As more benchmarks emerge, the full potential of these APUs will become clearer, shedding light on AMD’s vision for the future of mobile computing.

Source: PassMark

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Next-Gen 3D V-Cache Technology

A major highlight of the Ryzen 7 9800X3D is its incorporation of 2nd Gen AMD 3D V-Cache technology, which introduces a redesigned on-chip cache layout. AMD has moved the 64 MB of 3D V-Cache below the processor core complex die (CCD), bringing the cache closer to the heat sink. This layout change optimizes thermal dissipation, allowing the “Zen 5” cores to maintain cooler operating temperatures. The improved cooling architecture allows the processor to reach higher clock speeds more efficiently, resulting in an average 8% uplift in gaming performance over AMD’s previous generation and up to a 20% increase over competing products.

By positioning the cache in this way, AMD has also unlocked a key feature for performance enthusiasts: the Ryzen 7 9800X3D is the first X3D processor with full overclocking capabilities. Gamers and overclocking enthusiasts can now take advantage of this unlocked potential to push clock speeds and overall performance even further, marking a new era for AMD’s X3D processors.

Jack Huynh, Senior Vice President and General Manager of AMD’s Computing and Graphics division highlighted this innovation, saying, “With the introduction of the Ryzen 7 9800X3D processor, built on our advanced ‘Zen 5’ architecture, we are elevating gaming performance like never before. Featuring innovative 2nd Gen AMD 3D V-Cache technology, this processor reflects our commitment to excellence and our ability to innovate in ways that redefine the industry.”

Benchmark Performance for Gaming

AMD’s latest processor is designed to address the gaming industry’s demand for improved frame rates and stable performance in high-intensity titles. The Ryzen 7 9800X3D, built on the “Zen 5” architecture, is optimized for gaming scenarios, offering an 8% improvement in average FPS for most games over the last generation. Certain games, such as Star Wars Outlaws, are expected to experience double-digit percentage performance gains, while other titles, such as The Last of Us: Part I, show improved smoothness in gameplay. AMD reports that the Ryzen 7 9800X3D delivers a 31% higher 1% low frame rate in The Last of Us: Part I, providing smoother gaming with reduced stutter, even when average frame rates remain similar to competing processors.

These improvements mean gamers can expect faster response times and minimal frame dips during intensive gaming sequences, resulting in a consistently smooth experience that can be critical for competitive gaming or graphically demanding titles.

Ryzen 7 9800X3D Desktop Processor Specifications

Designed for maximum responsiveness and productivity, the Ryzen 7 9800X3D brings eight “Zen 5” cores and 16 threads, clocking in at a base speed of 4.7 GHz and a maximum boost clock of 5.2 GHz—an achievement that sets new performance standards for AMD’s X3D series. Its power rating of 120W TDP complements a substantial 104 MB of total cache, ensuring high-speed data access and handling for complex workloads and multitasking.

The Ryzen 7 9800X3D is priced at $479 USD, aiming to provide substantial value for high-end gaming setups and productivity-focused systems alike.

With this launch, AMD has strengthened its foothold in the high-performance computing market, delivering robust performance and a range of optimizations tailored for the latest gaming and productivity applications.

Source: AMD

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The Intel Core Ultra 200S series marks a significant step forward with its integrated Neural Processing Unit (NPU), making these processors the first of their kind to offer this capability on a desktop platform. In addition to this, the processors come equipped with a built-in Xe GPU that supports advanced media tasks, ensuring a high-performance experience for gaming, content creation, and other intensive applications.

Intel has also focused on improving power efficiency in the 200S series. According to Intel, these processors deliver up to 58% lower package power in everyday tasks and can reduce system power consumption by up to 165 W during gaming. The result is a cooler, quieter desktop experience without compromising performance, making these processors ideal for demanding use cases.

Performance-wise, the new series boasts up to 6% faster single-threaded and up to 14% faster multi-threaded processing compared to its predecessors. For AI-enabled applications, the Intel Core Ultra 200S series can achieve up to 50% faster performance than competing flagship processors. The NPU also allows for offloading specific tasks from the CPU and GPU, potentially improving gaming frame rates and reducing power usage during resource-intensive operations.

The Intel Core Ultra 200S series also supports the latest Intel 800 Series chipset, which enhances system compatibility. Users can benefit from up to 24 PCIe 4.0 lanes, 8 SATA 3.0 ports, and 10 USB 3.2 ports, allowing for advanced connectivity and storage options. In terms of overclocking, the processors offer fine-grain controls for both P-cores and E-cores and support DDR5 memory up to 192 GB.

For connectivity, the processors include 20 PCIe 5.0 lanes, 4 PCIe 4.0 lanes, and integrated support for Thunderbolt 4, Wi-Fi 6E, and Bluetooth 5.3. The integration of Intel Killer Wi-Fi enhances wireless performance, providing a seamless experience for online gaming and other bandwidth-intensive tasks.

Security remains a top priority with the Intel Core Ultra 200S series. The processors feature Intel Silicon Security Engine, which helps protect data confidentiality and code integrity while maintaining high performance for complex workloads.

The Intel Core Ultra 200S series will be available from October 24, 2024, through online and retail outlets, as well as in systems from Intel’s OEM partners.

Source: Intel

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The Intel Core Ultra 200 series is set to introduce a range of models, including the Core Ultra 5 245K, Core Ultra 7 265K, and Core Ultra 9 285K. Interestingly, the lineup skips the Core Ultra 3 model, with Intel choosing to continue supporting its existing Raptor Lake generation i3 chips instead. Among the highlights of the Core Ultra 200 series is the Core Ultra 9 285K, rumored to boast a boost clock frequency of approximately 5.5GHz. While slightly lower than the 14th Gen i9-14900K, which can reach speeds of up to 6.0GHz, it still promises significant performance gains.

One notable aspect of the Core Ultra 200 processors is their integrated GPU, which reportedly incorporates a maximum of 4 Xe computing cores. This marks a reduction from the 8 Xe cores found in the fastest laptop CPUs of the same line. These Xe cores are based on the Alchemist Xe-LPG design, with variations within the series expected to feature two or three Xe cores depending on the specific SKU. Additionally, the processors will include Lion Cove P-cores with an expanded L2 cache of 3MB for each core, along with a Skymont E-core cluster featuring 3MB of L3 cache.

Accompanying the Core Ultra 200 series are the Z890 motherboards, which are confirmed to support Thunderbolt 4 connectivity. These motherboards will be compatible with the new socket 1851, offering users enhanced connectivity options and future-proofing for upcoming technologies. The Z890 motherboards are slated to be officially unveiled at Computex 2024 in Taiwan next month, generating further excitement among PC enthusiasts and professionals alike.

The introduction of the Core Ultra 200 series signifies Intel’s ongoing efforts to refresh its processor lineup and maintain its competitiveness in the market. Earlier reports revealed Intel’s plans to rebrand its upcoming Arrow Lake CPUs as the Core Ultra 200 series, following a new naming convention introduced with the Meteor Lake lineup. Furthermore, Intel is expected to update its Raptor Lake-H laptop processors under the Core 200H series later this year.

Intel’s decision to revamp its processor naming conventions was announced in June last year, with the Core Ultra 200 series positioned to succeed the fourteenth generation Intel chips. However, specific release dates for these new CPUs have yet to be disclosed, leaving enthusiasts eagerly awaiting further updates from the tech giant.

As the industry awaits the official unveiling of the Core Ultra 200 series and Z890 motherboards at Computex 2024, anticipation continues to build around Intel’s latest innovations and their potential impact on the computing landscape. Stay tuned for more updates as the story develops.

Source: Wccftech, videocardz, MebiuW (Weibo), Golden Pig Upgrade

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