The introduction of these higher-core-count models raises questions about their potential gaming performance, as AMD’s 8-core 3D V-Cache processors have historically dominated in gaming benchmarks, hitting what many consider the “sweet spot” for gaming performance. While more cores generally benefit productivity tasks and multi-threaded workloads, their impact on gaming has been less pronounced.

Performance Expectations

A recent report by VideoGamer shed light on what enthusiasts can expect from these upcoming Ryzen 9 X3D chips. The publication obtained comments from Martijn Boonstra, a product and business development manager at AMD. Boonstra indicated that the gaming performance of the Ryzen 9 9950X3D and 9900X3D will be comparable to that of the Ryzen 7 9800X3D, stating:

“Our new chips will provide similar overall gaming performance to the Ryzen 7 9800X3D. There will be some games that perform a bit better—if the game engine utilizes more cores and threads—and some games will perform a little worse (if the game engine favors a single CCD configuration), but on the whole, the experience is comparable.”

This suggests that the higher core counts of the Ryzen 9 X3D models may offer benefits in games optimized for multi-threaded performance but will not uniformly outperform the 8-core Ryzen 7 9800X3D in all scenarios.

Pricing and Availability

While Boonstra refrained from disclosing specific pricing details for the upcoming processors, he mentioned that AMD plans to announce final pricing closer to launch. The Ryzen 7 9800X3D currently retails for $479, though availability remains inconsistent. It remains to be seen how AMD will position the Ryzen 9 9950X3D and 9900X3D within their existing product lineup and whether they will carry a significant price premium.

Market Position

AMD’s 3D V-Cache technology has proven to be a key differentiator in gaming performance, and the Ryzen 7000X3D series is marketed toward gamers and creators seeking high-performance solutions. Boonstra emphasized this positioning, stating that the new chips are designed to appeal to users across different platforms:

“Ryzen 9000X3D Series desktop processors are perfect for gamers and content creators alike…whether you are already on the AM5 platform, on AM4 or another platform, these products are sure to impress.”

With the AM5 platform gaining traction and support for DDR5 memory and PCIe 5.0 becoming more widespread, AMD is likely aiming to attract upgraders and new adopters as part of its strategy to maintain a competitive edge in the desktop CPU market.

Our Verdict

The Ryzen 9 9950X3D and 9900X3D are shaping up to be intriguing additions to AMD’s lineup, particularly for users who require additional cores for demanding workloads alongside gaming. However, the lack of a clear performance uplift over the Ryzen 7 9800X3D in gaming may temper expectations. More details, including pricing and official benchmarks, are expected as the March release window approaches.

Sources: VideoGamer, Tom’s Hardware, Wccftech

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Technical Overview

The Ryzen 9 9950X3D features 16 cores and 32 threads, while the Ryzen 9 9900X3D offers 12 cores and 24 threads. Both processors use a dual-CCD (Core Complex Die) design, similar to the Ryzen 9 7000X3D series. However, AMD has made significant improvements in how the 3D V-Cache is implemented. Unlike the previous generation, the 3D V-Cache in the “Zen 5” architecture is positioned below the CCD rather than above it. This design change enables the CCD with 3D V-Cache to achieve clock speeds comparable to the CCD without it. This is a notable improvement over earlier models, where the presence of 3D V-Cache often led to slightly reduced clock speeds.

To further optimize performance, AMD has refined its OS scheduler software. The updated scheduler ensures that productivity applications can efficiently utilize both CCDs, while gaming workloads are directed to the CCD equipped with 3D V-Cache. This selective utilization aims to maximize performance across diverse tasks.

Specifications

The Ryzen 9 9950X3D has a base clock of 4.30 GHz and boosts up to 5.70 GHz, with a thermal design power (TDP) of 170 W. This marks a significant improvement in boost frequency compared to the Ryzen 7 9800X3D, which maxes out at 5.20 GHz. AMD positions the 9950X3D as the fastest gaming desktop processor in its lineup.

The Ryzen 9 9900X3D, on the other hand, offers a base clock of 4.40 GHz and a maximum boost clock of 5.50 GHz. While its CCD with 3D V-Cache has only six cores, its high clock speeds make it an attractive option for users seeking balanced performance in gaming and productivity tasks.

Performance Benchmarks

AMD reports that the Ryzen 9 9950X3D is, on average, 8% faster than its predecessor, the 7950X3D, in gaming workloads. It also outperforms the Intel Core Ultra 9 285K by 20% in gaming tests conducted across 40 titles. For productivity workloads, the 9950X3D delivers 13% higher performance than the 7950X3D and is 10% faster than the Core Ultra 9 285K in a range of benchmarked tasks.

AMD has yet to release first-party performance data for the Ryzen 9 9900X3D, but based on its specifications, it is expected to compete closely with the 9800X3D in gaming and deliver faster performance in multi-threaded productivity workloads than non-X3D Ryzen 9000 processors.

Market Position and Availability

AMD asserts that the Ryzen 9 9950X3D is the “world’s best processor” for both gaming and productivity, a claim that underscores its aim to maintain a competitive edge against Intel’s latest offerings. The 9900X3D is expected to appeal to users seeking a more affordable yet high-performance option within the Ryzen 9000X3D lineup.

Both processors are scheduled for release in Q1 2025, with further details on pricing and availability expected to follow in the coming months. These additions to AMD’s portfolio demonstrate the company’s commitment to advancing desktop processor technology, leveraging innovations in cache design and microarchitecture to deliver higher performance and efficiency.

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The processor features AMD’s refined cache architecture, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache, totaling 128 MB of L3 cache, alongside an additional 16 MB of L2 cache. Unlike its predecessor, the Ryzen 9 7950X3D, the new design incorporates a revamped CCD stacking method. The redesigned configuration positions the CCD above the cache, interfacing directly with the STIM (Soldered Thermal Interface Material) and IHS (Integrated Heat Spreader). This improvement eliminates thermal constraints that previously limited clock speeds on X3D chips, enabling higher operational frequencies.

The Ryzen 9 9950X3D features an asymmetric cache distribution across its dual CCDs. One CCD includes 32 MB of standard L3 cache paired with an additional 64 MB of stacked 3D V-Cache, while the second CCD contains a standard 32 MB L3 cache. This design allows the processor to optimize performance for gaming and productivity workloads while maintaining an efficient thermal profile.

The processor achieves a maximum boost clock of 5.65 GHz across both CCDs, matching the performance of non-X3D variants. Maintaining a 170 W TDP, the Ryzen 9 9950X3D demonstrates improved thermal efficiency despite the additional cache layer. AMD’s software-based OS scheduler remains a crucial component of the design, ensuring gaming workloads are directed to the CCD equipped with 3D V-Cache for optimal performance.

Preliminary performance leaks suggest that the Ryzen 9 9950X3D matches the base Ryzen 9 9950X in Cinebench R23 scores for both single-threaded and multi-threaded benchmarks. This is a notable improvement compared to the Ryzen 9 7950X3D, which exhibited lower performance than its non-X3D counterpart due to frequency limitations imposed by its thermal constraints. These results indicate AMD has successfully mitigated the challenges associated with integrating 3D V-Cache on high-core-count processors.

AMD’s plans for the Zen 5 X3D lineup include the Ryzen 9 9950X3D as well as the 12-core Ryzen 9 9900X3D, both expected to launch in the first quarter of 2025. Full performance benchmarks, pricing, and additional details are anticipated at CES 2025, where AMD is expected to officially unveil the new processors. The event will also mark the debut of AMD’s next-generation RDNA 4 GPUs, further highlighting the company’s advancements in high-performance computing.

Sources: @94G8LA, via VideoCardz

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In addition to CPU enhancements, Strix Halo APUs are set to redefine expectations in integrated graphics performance. Unlike traditional APUs that rely on basic graphics capabilities, Strix Halo will include RDNA 3.5-based integrated GPUs (iGPUs) with an unprecedented number of compute units (CUs). This innovation is expected to challenge entry-level and even mid-range discrete GPUs, potentially reducing the need for dedicated graphics cards in certain use cases.

Performance Expectations

Recent leaks suggest that the flagship APU in the Strix Halo lineup, reportedly named Ryzen Max+ Pro 395, will include an integrated GPU branded as the Radeon 8060S. This iGPU features 40 compute units, leveraging AMD’s RDNA 3.5 architecture. Benchmark results have started to surface, showcasing the potential of this integrated solution.

In a Geekbench Vulkan benchmark, the Radeon 8060S outperformed NVIDIA’s RTX 4060 Laptop GPU, a discrete solution often found in mid-range gaming laptops. This is a significant achievement for an iGPU, signaling AMD’s capability to bridge the gap between integrated and discrete graphics performance. However, other benchmarks, such as PassMark, paint a slightly different picture. According to leaked PassMark scores, the Radeon 8060S achieved 16,454 points, while the 32-CU Radeon 8050S scored a slightly higher 16,663 points. This surprising result suggests that the benchmark data may not yet reflect the final performance of retail units, especially considering the small performance delta between the two models despite a substantial difference in CU count.

When compared to discrete GPUs, these performance numbers place the Radeon 8060S in a similar performance bracket to NVIDIA’s RTX 3080 Laptop GPU. While this falls short of the newer RTX 4070 Laptop GPU, it remains an impressive feat for an integrated graphics solution. Moreover, as AMD finalizes driver optimizations and firmware updates, the actual performance of retail Strix Halo APUs is likely to surpass these preliminary results.

A Game-Changer for Mobile Devices

The Strix Halo lineup’s capabilities could transform the design of portable devices, particularly laptops and tablets. One notable example is the upcoming ROG Flow Z13 tablet, which is rumored to feature a Strix Halo APU. With the inclusion of high-performance Zen 5 cores and a powerful RDNA 3.5 iGPU, devices like the Flow Z13 may offer desktop-class computing and gaming experiences without the need for discrete graphics hardware. This approach not only reduces the overall cost and complexity of the system but also improves battery efficiency and thermal performance.

What This Means for the Market

AMD’s Strix Halo APUs signal a shift in the balance between integrated and discrete graphics solutions. By offering integrated GPUs that rival mid-range discrete options, AMD could disrupt traditional laptop configurations. This is especially relevant for lightweight gaming laptops, ultra-portables, and creative workstations, where space, weight, and power consumption are critical considerations.

Furthermore, the enhanced multicore performance of Zen 5 and the graphics capabilities of RDNA 3.5 could attract a broader audience, from gamers to professionals. If AMD can deliver on its promise of performance and efficiency, the Strix Halo lineup may establish a new standard for what integrated solutions can achieve.

The Road Ahead

As the official launch of Strix Halo APUs approaches, more details about their final specifications and performance are expected to emerge. Early benchmarks, while promising, highlight the need for further refinements. AMD’s ability to address these initial inconsistencies and deliver a polished product will be crucial to its success in this highly competitive market.

With Strix Halo, AMD is poised to challenge the traditional boundaries of integrated graphics, offering a compelling alternative to discrete GPUs in portable systems. Whether this vision materializes fully will depend on the final execution, but the potential is undeniable.

Source: Passmark

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Expanding the Ryzen 9000X3D Family

On the CPU front, AMD is anticipated to expand its Ryzen 9000X3D lineup with high-core count models such as the Ryzen 9 9950X3D and Ryzen 9 9900X3D. These processors are expected to leverage the company’s cutting-edge 3D V-Cache technology to deliver enhanced gaming and multitasking performance. Alongside these high-end models, AMD is reportedly preparing to introduce power-efficient 65 W variants of its non-X3D Ryzen 9000 series processors, based on the “Zen 5” architecture. These models aim to offer an attractive value proposition for mainstream users, targeting potential buyers of Intel’s 65 W Core Ultra “Arrow Lake-S” processors.

Radeon RX 9000 Series Debut

On the gaming graphics front, AMD is set to unveil its next-generation Radeon RX 9000 series. Leading this lineup are the Radeon RX 9070 XT and RX 9070, which will be powered by the new “Navi 48” silicon and the RDNA 4 graphics architecture. These GPUs are expected to deliver significant performance and efficiency improvements over the previous generation, with enhancements aimed at both gamers and creators. The introduction of RDNA 4 is likely to include architectural upgrades that push performance-per-watt metrics further, ensuring AMD remains competitive in the high-performance GPU market.

Introduction of FSR 4 Technology

In addition to hardware announcements, AMD is expected to introduce FidelityFX Super Resolution (FSR) 4, the latest iteration of its performance enhancement technology for gaming. According to leaks, FSR 4 will build upon the features of FSR 3.x by integrating advanced upscaling techniques and frame-generation technology. Unlike its predecessors, FSR 4 is expected to incorporate new methods to improve visual fidelity and frame-generation accuracy. While specific details are yet to be confirmed, FSR 4 could mark a significant leap in gaming performance enhancement by delivering higher-quality visuals and smoother gameplay experiences.

Launch and Availability Timeline

Reports indicate that AMD’s announcements at CES 2025 will be followed by the hardware’s availability later in January. This timeline suggests that AMD is aiming to capitalize on the post-holiday tech market, providing gamers and PC enthusiasts with access to the latest CPUs and GPUs within weeks of their unveiling.

Industry Implications

The announcements expected from AMD at CES 2025 underscore the company’s commitment to advancing computing and graphics technologies. By expanding its Ryzen 9000X3D lineup, introducing power-efficient “Zen 5” CPUs, and debuting the Radeon RX 9000 series alongside FSR 4, AMD is signaling a strategy that emphasizes both performance leadership and value-driven innovation. As competition intensifies in the processor and graphics markets, AMD’s latest offerings are likely to play a crucial role in shaping the industry’s trajectory for the coming year.

Source: VideoCardz

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Cooling Solution and Compatibility

Intel’s 65 W Core Ultra 200-series models will reportedly be compatible with the company’s Laminar series fan-heatsinks, originally introduced with the 12th Gen Core “Alder Lake” processors. The new processors retain Socket LGA1851, which shares cooler compatibility with the older LGA1700 socket. This design decision simplifies the inclusion of existing cooling solutions, potentially reducing production complexity and cost.

The Core Ultra 9 65 W retail box is notably larger than others in the lineup, hinting at the inclusion of the high-capacity Laminar RH1 cooler. Designed for processors with elevated power demands, the RH1 features blue LED lighting and sufficient thermal performance to handle peak turbo power levels.

For the Core Ultra 7 and Core Ultra 5 65 W models, the boxes appear to have similar dimensions. These processors are likely to be paired with the Laminar RM1 cooler, which offers a balance of thermal performance and aesthetics. The RM1 features a thinner heatsink compared to the RH1 but includes an illuminated ring around the fan frame.

If Intel introduces a Core Ultra 3 model as part of this series, it may include the Laminar RS1 cooler. The RS1 is the most basic variant in the lineup, designed for entry-level processors and lacking any lighting elements. Its compact design and simpler build make it suitable for lower power consumption models.

Standard and “F” Variants

Images of the retail packaging show clear distinctions between the standard variants and the “F” variants of the 65 W processors. The standard models include integrated graphics, while the “F” models do not. The latter’s packaging is differentiated by slight design variations, making it easier for consumers to identify the specific features of the processors they are purchasing.

Visual Overview

The first three images highlight the retail boxes for the standard Core Ultra 9, Core Ultra 7, and Core Ultra 5 65 W models. These boxes emphasize the inclusion of cooling solutions and feature distinctive designs tailored to each processor tier. The fourth and fifth images focus on the “F” variants, which share similar dimensions and design elements with their standard counterparts but cater to users who do not require integrated graphics capabilities.

Anticipation for January Launch

The Core Ultra 200-series “Arrow Lake-S” processors represent Intel’s continued evolution in desktop performance. By including bundled cooling solutions and maintaining compatibility with existing sockets, Intel aims to deliver a more user-friendly and cost-effective experience for consumers. With the launch date set for January 2025, these processors are expected to offer significant competition in the mainstream desktop market.

Source: momomo_us (Twitter)

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Benchmark Revelations: A 4+4 Configuration

The PassMark result confirms that the Ryzen AI 7 350 features a 4+4 CPU core configuration, combining AMD’s Zen 5 and Zen 5c cores. This hybrid architecture aims to balance performance and efficiency, with the Zen 5 cores focusing on high-performance tasks and the Zen 5c cores emphasizing energy efficiency. This design aligns with AMD’s strategy of optimizing battery life and thermal performance, potentially positioning these APUs as a direct response to Qualcomm’s advancements in mobile processing.

A Downgrade in Integrated Graphics

One notable departure from tradition lies in the integrated GPU (iGPU) configuration. Historically, Ryzen 7 and Ryzen 9 mobile APUs have included high-performance Radeon -80M or -90M series iGPUs. However, the Ryzen AI 7 350 features the AMD Radeon 860M, a step down from its predecessors. The naming convention aligns the 860M more closely with iGPUs found in Ryzen 5 APUs, suggesting it may deliver less graphical performance compared to previous generations.

Early benchmarks support this hypothesis. A comparison between the Radeon 760M and the Radeon 860M on PassMark shows the latter lagging behind by an average of 9.1%. It is worth noting, however, that the data pool for the 860M is currently limited to a single result, so these figures should be interpreted with caution. The potential performance gap highlights AMD’s likely focus on reducing power consumption and heat output rather than maximizing graphics performance in this iteration.

Strategic Implications for AMD

The decision to prioritize energy efficiency over graphical prowess could mark a strategic pivot for AMD. By adopting the 4+4 hybrid architecture and scaling back the iGPU, the Ryzen AI Kraken Point APUs may cater to a market segment increasingly concerned with portability and battery longevity. This approach could broaden the appeal of AMD’s APUs, particularly for devices like ultra-thin laptops and entry-level gaming handhelds, where extended battery life is critical.

Broader Market Context

This development comes at a time when competition in the mobile processor space is intensifying. Qualcomm’s latest offerings, featuring advanced efficiency cores and integrated AI capabilities, have set a high bar for competitors. AMD’s decision to adopt a heterogenous core architecture and scale back the iGPU in the Ryzen AI 7 350 appears to be a calculated response, aimed at carving out a niche in the evolving landscape of portable computing.

Our Verdict

The Ryzen AI Kraken Point APUs, led by the Ryzen AI 7 350, represent a nuanced shift in AMD’s mobile processor strategy. While the reduced iGPU performance might raise eyebrows, the emphasis on efficiency and thermal management suggests a targeted approach to addressing the needs of modern thin-and-light laptops and gaming handhelds. As more benchmarks emerge, the full potential of these APUs will become clearer, shedding light on AMD’s vision for the future of mobile computing.

Source: PassMark

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While the Y40 shares a common trait with its counterpart, the Y60 PC Case, in supporting only vertical graphics card installation, their differences extend far beyond aesthetics. Despite both models sporting unique glazing, with a solid glass front complementing a classic side panel, their internal layouts and constructions diverge significantly. Where the Y60 embraces an unconventional, almost “cube-like” shape, the Y40 maintains a more traditional ATX case layout, with the power supply situated under the bottom tunnel. Despite these distinctions, both models exude HYTE’s commitment to innovation and quality craftsmanship.

Available in four striking color variations—including tested contrast White/Black, Pure White, Pure Black, and Red/Black—the Y40 surprises with its affordability. Despite its unique design and premium features, the price remains accessible, making it an enticing option for enthusiasts seeking a blend of style and functionality in their PC builds. Stay tuned as we delve deeper into the performance and usability of the HYTE Y40, exploring how it stands out in the competitive landscape of PC cabinets.

Unboxing

The outer packaging of the HYTE Y40 chassis is presented in a robust and environmentally friendly neutral cardboard box, which not only showcases the product’s assembled and disassembled configurations but also features comprehensive technical specifications on one side. This thoughtful design allows prospective users to gain insights into the chassis before even opening the package. Upon unboxing, the chassis itself is securely nestled within layers of protection, including a thick cork frame and a plastic bag, ensuring that it arrives intact and undamaged, ready for assembly.

Delving further into the package, users will discover a hidden cardboard box containing a set of accessories, along with the user manual. While the manual may be minimalist, it includes essential information, complemented by a practical TRRS jack to double the TRS jack adapter cable. This addition proves particularly handy, resolving any compatibility concerns with the TRRS connector on the front of the chassis, thereby enhancing the overall user experience and satisfaction with the product.

Design

Exterior

The HYTE Y40 chassis introduces a fresh perspective to the Mid-Tower format, boasting dimensions of 439 mm x 240 mm with distinctively thin upper and lower edges, setting it apart from its predecessors. Its contemporary and striking design is immediately captivating; appearing wide and shallow, though this effect is partly a result of its unique design which limits frontal possibilities. The chassis features a pair of panoramic glasses, seamlessly joined without any visible corners, offering a clear view of the interior despite the dark tinting. Impressions of premium quality are undeniable, owing to the impeccable fit between the front and side panels, and the remarkable choice of materials.

Located on the lower central plane of the chassis, the control panel boasts a functional array of features. It comprises a versatile 3.5″ jack connector designed for audio and microphone integration, alongside a dual USB 3.0 connector facilitating rapid data transfer. A conspicuous square LED button commands the power state of the device, offering intuitive control. Complementing these interfaces is a USB 3.2 Type-C connector, enhancing connectivity options for modern peripherals and devices. Together, these elements form a comprehensive control hub, ensuring seamless operation and accessibility for users.

The HYTE Y40 impresses with its main side, which grants a clear view into the chassis’s interior, drawing attention to the riser cable, a feature to be explored further. This side is dominated by a generously sized tempered glass panel, offering a stark contrast with the sleek white chassis and framed by slim top and bottom edges. Secured by four pressure studs, the panel facilitates tool-free access to the chassis.

However, it’s the lid on the secondary side that truly commands attention, boasting a striking red hue in this particular version and a pattern of strategically placed openings designed to enhance internal cooling. The lid’s design features a series of semi-angled stripes, ingeniously allowing air to flow into the chassis, optimizing thermal performance. The design elements of the side panel extend seamlessly into the upper region, maintaining continuity and facilitating airflow. Inside, the layout appears more streamlined, featuring uniquely designed dust filters that can be effortlessly detached for cleaning.

The audacious aesthetic extends downward with angular plastic components supporting the chassis, adorned with foam rubber pads. Here, two additional dust filters, resembling intricate spider webs, add a touch of flair to the overall design.

Turning our attention to the chassis, we observe a distinct rear side characterized by its unique slot configuration, though a closer inspection from within will provide a clearer view. Notably, the rear area boasts design innovations setting it apart from other chassis models. Featuring seven horizontal low-profile expansion slots alongside an additional four conventional-sized vertical slots, this configuration offers versatile compatibility for various components. Complementing this layout is a 120mm fan operating at 1300 rpm, diligently expelling hot air from within the case to maintain optimal thermal conditions.

Interior

The chassis offers convenient accessibility with its tool-free removal of side and upper covers, secured in place by clips. Its interior metal covers boast an innovative design that facilitates airflow to essential areas. With compatibility for ATX-type motherboards and smaller variants, as well as support for any cooler up to 183mm in height and a 280/240/140/120 mm radiator, it provides ample space for customization.

Additionally, the option to install a pair of 120/140 mm fans ensures efficient ventilation, particularly beneficial when the front is closed. The chassis accommodates GPUs up to 422mm in length, with a recommended maximum height of 94mm for optimal component cooling, although Hyte suggests staying under 80mm for best results. Notably, the inclusion of a raised cable allows for vertical positioning of the graphics card, adding a unique touch to the setup.

The standout feature of the HYTE Y40 chassis is undeniably its bundled PCIe 4.0 riser cable, a noteworthy inclusion given their typically high cost. What sets it apart even further is its strikingly original and intricately designed aesthetic. Another distinctive characteristic of the HYTE Y40 is its provision of 7 horizontal low-profile slots, facilitating easy access to all motherboard connectors without necessitating a riser cable, provided the cards are of equal low profile. Additionally, the chassis boasts 4 vertical slots capable of accommodating full-format cards, particularly graphics cards.

The fairing serves as a protective casing for the lower region, concealing the power supply unit within. Crafted from plastic material, it seamlessly integrates with the exterior design, featuring grooves that harmonize with the aesthetic showcased in the preceding section.

In the upper region of the chassis, there is ample space to accommodate a triple radiator measuring up to 360 mm in length, allowing for efficient cooling of the system. This radiator can be effectively complemented by 120 mm fans, ensuring optimal airflow and heat dissipation within the chassis. With this configuration, users can expect enhanced thermal performance, enabling their hardware to operate at optimal temperatures even under heavy loads.

Let’s take a closer look at the HYTE Y40 backside and explore the ample space available behind the motherboard tray for organizing wiring, along with the area adjacent to the power supply, where cables can be neatly concealed. Behind the motherboard lies a convenient tray that accommodates either a pair of 2.5-inch drives or a single 3.5-inch unit, albeit with a thickness restriction of 24 mm. Consequently, storage options may be somewhat limited, although the prevalence of M.2 SSDs is gradually diminishing the necessity for traditional storage units in many computer setups.

In the lower area of the setup, there’s an additional 120 mm fan running at 1300 RPM, complementing the cooling system. This area also offers ample space for an ATX power supply unit, accommodating sizes up to 224 mm deep. It’s an ideal spot for organizing excess wiring, ensuring a clean and tidy appearance for the visible components in the main section of the equipment. Taking a closer look at the wiring, it’s as expected, featuring headers for USB and sound connections, along with PWM connectors tailored for the fans, providing efficient control over their operation.

Installation

We effortlessly integrated a comprehensive system within the HYTE Y40 case, incorporating an mATX motherboard with Silicon Power XPOWER Zenith DDR5 Memory, an Intel Core i7-12700K processor, a dual 120mm side fan, an upper 360mm Yeston liquid cooler, and a Predator BiFrost Intel® Arc A770 OC 16GB graphics card utilizing the included Riser. The cable management was a breeze, facilitated by well-sized cable glands, allowing smooth passage for power cables from the CPU, GPU, and power source.

The interior of the HYTE Y40 Case is truly remarkable, boasting an impressive appearance that immediately catches the eye. The double panoramic tempered glass provides a breathtaking view of the components within. This design not only adds a touch of elegance to the case but also allows users to showcase their high-performance hardware in all its glory. Whether it’s the intricate details of a liquid cooling system or the sleek lines of a powerful graphics card, the double panoramic tempered glass ensures that every aspect of the interior is on full display, making for a truly immersive computing experience.

Cooling and AirFlow

Thermal performance is crucial for ensuring optimal operation of any PC case. Despite its exterior appearance and apparent silence, a PC’s internal temperature can soar if airflow is insufficient. It is imperative for a PC case to facilitate adequate airflow to keep components cool under heavy loads and prevent thermal throttling.

Testing of the Hyte case was conducted with side panels and the top cover installed, simulating real-world conditions. The case underwent a rigorous 16-minute stress test using the game Assassin’s Creed Odyssey. Following the test, two series of readings averaging 2 minutes each were taken to assess the CPU and GPU temperatures and frequencies. The results revealed average temperatures of 48.7°C for the processor and 67.6°C for the graphics card, indicating satisfactory thermal performance.

While the case maintained relatively cool temperatures, enhancements could be made to further improve airflow. The inclusion of one fan at the bottom and one at the back contributed to the case’s thermal management capabilities. However, incorporating two intake fans on the side, as recommended by Hyte, would provide additional airflow and optimize thermal performance. By following Hyte’s suggested fan configuration, users can ensure their PC remains cool and performs optimally, even under demanding workloads.

Acoustics

The overall noise level was measured at 55 dBA, with an ambient noise level of 33 dBA. While this is slightly higher than ideal, it’s important to note that all fans were operating at full speed during testing. With fans running at maximum capacity, it’s expected that noise levels would be elevated. Adjusting fan speeds or opting for quieter fan models could help mitigate noise levels without compromising on thermal performance.

Conclusion

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The new Ryzen 7 9800X3D, a high-end 8-core processor, will officially launch on November 7 with a price tag of $479. These desktops, built around the processor’s performance, are expected to cater to gamers and content creators looking for a powerful yet cost-effective option in the market. AMD has collaborated with prominent hardware brands to develop these systems, creating a cohesive package that brings together advanced cooling solutions, robust memory configurations, and a mix of AMD and NVIDIA graphics cards, offering consumers flexibility in performance and price.

Key Specifications and Partnerships

To create these prebuilt systems, AMD partnered with several established component manufacturers. ASUS, a key partner, supplies both motherboards and select graphics cards. Most configurations feature the ASUS TUF Gaming B650M-Plus motherboard, known for its durability and gaming-focused performance features. However, one variant includes the ASUS Prime X670E-Pro motherboard, a more premium option, paired with a larger 2 TB storage drive.

Cooling is handled by G.Skill, which provides its 360 mm Frozen Infinity AIO liquid cooling system. This cooling solution is essential for managing the high-performance demands of the Ryzen 7 9800X3D, particularly under heavy gaming or multitasking workloads. For the chassis, AMD enlisted LOONGTR, which designed cases that reflect the Ryzen branding and aesthetic. Each desktop is also equipped with 32 GB of DDR5-6000 memory to handle intensive applications smoothly, ensuring that users experience minimal lag or performance drops during usage.

Configuration and Pricing Options

AMD is offering seven different configurations, giving users a range of options that cater to various performance needs and budgets. Entry-level models, priced around $1,000, come without a discrete graphics card, allowing users to install their preferred GPU. For those seeking an all-in-one solution, high-end configurations with AMD’s RX 7900 XTX or NVIDIA’s latest RTX 4070 Super and RTX 4070 Ti Super cards are also available. These top-tier options, priced up to $2,100, provide competitive graphics performance, suitable for gaming at higher resolutions or handling graphics-intensive workloads.

The systems will launch on November 7, aligning with the release of the Ryzen 7 9800X3D processor. This timing is set to capitalize on the upcoming Singles’ Day on November 11, one of China’s largest shopping events, during which consumers often seek out deals on new electronics and hardware.

Below is a summary of AMD’s prebuilt configurations:

AMD’s Growing Presence in the Chinese Prebuilt Market

This series of prebuilt desktops follows AMD’s previous success in China’s market, where the company already offers systems featuring various Ryzen processors and a range of AMD Radeon graphics cards, including the RX 6750 GRE, a model available exclusively in China. By assembling these desktops with carefully selected, high-performance components, AMD is positioned to appeal to a broad base of users from gamers to professional creators who require a balance of cost and capability.

AMD’s direct involvement in building and selling these systems showcases its commitment to the prebuilt desktop market, reflecting an effort to provide quality systems tailored to the Chinese consumer market’s preferences and demands. The addition of NVIDIA graphics card options in certain models is a strategic choice, as it caters to consumers loyal to both AMD and NVIDIA GPUs, further broadening the appeal of these systems.

Availability and Market Timing

The desktop series will be available for purchase on JD.com beginning November 7, the same day as the Ryzen 7 9800X3D launch. This strategic release date allows AMD to leverage the hype surrounding Singles’ Day, China’s largest annual shopping festival on November 11, providing an opportunity to boost initial sales and potentially gain a foothold in China’s competitive prebuilt market.

Through this direct-to-consumer approach and curated hardware selection, AMD continues to expand its product ecosystem in China, aligning its offerings with the evolving demands of consumers in one of the world’s largest technology markets.

Source: VideoCardz

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Next-Gen 3D V-Cache Technology

A major highlight of the Ryzen 7 9800X3D is its incorporation of 2nd Gen AMD 3D V-Cache technology, which introduces a redesigned on-chip cache layout. AMD has moved the 64 MB of 3D V-Cache below the processor core complex die (CCD), bringing the cache closer to the heat sink. This layout change optimizes thermal dissipation, allowing the “Zen 5” cores to maintain cooler operating temperatures. The improved cooling architecture allows the processor to reach higher clock speeds more efficiently, resulting in an average 8% uplift in gaming performance over AMD’s previous generation and up to a 20% increase over competing products.

By positioning the cache in this way, AMD has also unlocked a key feature for performance enthusiasts: the Ryzen 7 9800X3D is the first X3D processor with full overclocking capabilities. Gamers and overclocking enthusiasts can now take advantage of this unlocked potential to push clock speeds and overall performance even further, marking a new era for AMD’s X3D processors.

Jack Huynh, Senior Vice President and General Manager of AMD’s Computing and Graphics division highlighted this innovation, saying, “With the introduction of the Ryzen 7 9800X3D processor, built on our advanced ‘Zen 5’ architecture, we are elevating gaming performance like never before. Featuring innovative 2nd Gen AMD 3D V-Cache technology, this processor reflects our commitment to excellence and our ability to innovate in ways that redefine the industry.”

Benchmark Performance for Gaming

AMD’s latest processor is designed to address the gaming industry’s demand for improved frame rates and stable performance in high-intensity titles. The Ryzen 7 9800X3D, built on the “Zen 5” architecture, is optimized for gaming scenarios, offering an 8% improvement in average FPS for most games over the last generation. Certain games, such as Star Wars Outlaws, are expected to experience double-digit percentage performance gains, while other titles, such as The Last of Us: Part I, show improved smoothness in gameplay. AMD reports that the Ryzen 7 9800X3D delivers a 31% higher 1% low frame rate in The Last of Us: Part I, providing smoother gaming with reduced stutter, even when average frame rates remain similar to competing processors.

These improvements mean gamers can expect faster response times and minimal frame dips during intensive gaming sequences, resulting in a consistently smooth experience that can be critical for competitive gaming or graphically demanding titles.

Ryzen 7 9800X3D Desktop Processor Specifications

Designed for maximum responsiveness and productivity, the Ryzen 7 9800X3D brings eight “Zen 5” cores and 16 threads, clocking in at a base speed of 4.7 GHz and a maximum boost clock of 5.2 GHz—an achievement that sets new performance standards for AMD’s X3D series. Its power rating of 120W TDP complements a substantial 104 MB of total cache, ensuring high-speed data access and handling for complex workloads and multitasking.

The Ryzen 7 9800X3D is priced at $479 USD, aiming to provide substantial value for high-end gaming setups and productivity-focused systems alike.

With this launch, AMD has strengthened its foothold in the high-performance computing market, delivering robust performance and a range of optimizations tailored for the latest gaming and productivity applications.

Source: AMD

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