Indications of an Imminent Launch

While AMD has yet to disclose an official release date, these database updates suggest that the Ryzen 9 9950X3D and 9900X3D are approaching launch readiness. Previous leaks and industry sources have pointed to a March release window, although some earlier rumors suggested a potential January launch, which now appears unlikely. The inclusion of these CPUs in ASRock’s support list implies that motherboard vendors are finalizing their firmware support ahead of a potential announcement from AMD.

Specifications and Market Positioning

The Ryzen 9 9950X3D is expected to feature 16 cores and AMD’s 3D V-Cache technology, enhancing gaming performance by increasing cache capacity and reducing memory latency. Similarly, the Ryzen 9 9900X3D is anticipated to offer 12 cores, making it a slightly lower-tier but still high-performance alternative. Both processors are part of AMD’s “Granite Ridge” lineup, built on the Zen 5 architecture, which aims to deliver improved efficiency and performance over its predecessors.

Recent statements from AMD representatives suggest that these new chips will offer gaming performance comparable to the already-released Ryzen 7 9800X3D. However, with additional cores, these models could provide better multi-threaded performance for productivity tasks. Pricing details remain undisclosed, but given AMD’s historical approach, they are expected to be positioned at a premium compared to their non-3D counterparts.

Availability and Supply Concerns

The availability of AMD’s 3D V-Cache processors has been a recurring issue, with the Ryzen 7 9800X3D experiencing periodic shortages since its launch. If demand for the 9950X3D and 9900X3D follows a similar trend, securing one of these chips at release may be challenging. Enthusiasts and PC builders are closely monitoring retailers for pre-order listings and further supply chain insights.

Looking Ahead

With ASRock leading the charge in publicly listing support for these processors, it is expected that other motherboard manufacturers will soon update their compatibility lists. AMD’s official confirmation of specifications, pricing, and availability details is highly anticipated, as these CPUs could offer compelling performance benefits for gamers and professionals alike. Until then, the PC hardware community will continue to analyze BIOS updates and manufacturer databases for additional clues about the upcoming launch.

Sources: ASRock CPU Support List, TechRadar, VideoCardz

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The introduction of these higher-core-count models raises questions about their potential gaming performance, as AMD’s 8-core 3D V-Cache processors have historically dominated in gaming benchmarks, hitting what many consider the “sweet spot” for gaming performance. While more cores generally benefit productivity tasks and multi-threaded workloads, their impact on gaming has been less pronounced.

Performance Expectations

A recent report by VideoGamer shed light on what enthusiasts can expect from these upcoming Ryzen 9 X3D chips. The publication obtained comments from Martijn Boonstra, a product and business development manager at AMD. Boonstra indicated that the gaming performance of the Ryzen 9 9950X3D and 9900X3D will be comparable to that of the Ryzen 7 9800X3D, stating:

“Our new chips will provide similar overall gaming performance to the Ryzen 7 9800X3D. There will be some games that perform a bit better—if the game engine utilizes more cores and threads—and some games will perform a little worse (if the game engine favors a single CCD configuration), but on the whole, the experience is comparable.”

This suggests that the higher core counts of the Ryzen 9 X3D models may offer benefits in games optimized for multi-threaded performance but will not uniformly outperform the 8-core Ryzen 7 9800X3D in all scenarios.

Pricing and Availability

While Boonstra refrained from disclosing specific pricing details for the upcoming processors, he mentioned that AMD plans to announce final pricing closer to launch. The Ryzen 7 9800X3D currently retails for $479, though availability remains inconsistent. It remains to be seen how AMD will position the Ryzen 9 9950X3D and 9900X3D within their existing product lineup and whether they will carry a significant price premium.

Market Position

AMD’s 3D V-Cache technology has proven to be a key differentiator in gaming performance, and the Ryzen 7000X3D series is marketed toward gamers and creators seeking high-performance solutions. Boonstra emphasized this positioning, stating that the new chips are designed to appeal to users across different platforms:

“Ryzen 9000X3D Series desktop processors are perfect for gamers and content creators alike…whether you are already on the AM5 platform, on AM4 or another platform, these products are sure to impress.”

With the AM5 platform gaining traction and support for DDR5 memory and PCIe 5.0 becoming more widespread, AMD is likely aiming to attract upgraders and new adopters as part of its strategy to maintain a competitive edge in the desktop CPU market.

Our Verdict

The Ryzen 9 9950X3D and 9900X3D are shaping up to be intriguing additions to AMD’s lineup, particularly for users who require additional cores for demanding workloads alongside gaming. However, the lack of a clear performance uplift over the Ryzen 7 9800X3D in gaming may temper expectations. More details, including pricing and official benchmarks, are expected as the March release window approaches.

Sources: VideoGamer, Tom’s Hardware, Wccftech

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This marks the first official acknowledgment of Sapphire’s Radeon RX 9000-series designs outside of trade shows. The subdued reveal strategy suggests that Sapphire is pacing its announcements in alignment with AMD’s release schedule for its RDNA 4 GPU architecture.

CES Showcase Highlights PURE Series

At the recent CES 2024 trade event, Sapphire showcased its PURE series graphics card, another custom design for AMD’s Radeon RX 9000-series. The PURE model, highlighted in a TechPowerUp report, was displayed as part of a broader lineup of partner products. Its clean design and focus on cooling performance caught attention, but its technical details and pricing remain under wraps.

Interestingly, the PULSE model was absent from CES, leaving observers to speculate that Sapphire is holding back key product reveals until AMD finalizes the release timeline for RDNA 4 GPUs.

NITRO+ Model Teased in Marketing Material

In addition to the PULSE teaser, a new NITRO+ model was subtly featured in AMD’s CES-related promotional material, according to VideoCardz. At the same time, Sapphire chose not to display the NITRO+ card at the trade show, its inclusion in official marketing hints at a significant role for the flagship series in the Radeon RX 9000 lineup.

The delay in showcasing the NITRO+ and other models could be tied to AMD’s yet-to-be-announced launch date for the RX 9000 series. Industry analysts predict that marketing efforts from board partners like Sapphire will intensify as AMD moves closer to confirming a release window.

RDNA 4 Launch Anticipation

The Radeon RX 9000-series, built on AMD’s RDNA 4 architecture, is expected to bring advancements in performance and energy efficiency, appealing to both gamers and creators. The RX 9070 XT and RX 9070 are poised to compete in the high-performance GPU market, and Sapphire’s PULSE and NITRO+ models will likely cater to different segments of users.

Sapphire’s strategy of staggered reveals, starting with the PULSE teaser, builds anticipation while maintaining flexibility as AMD finalizes its launch plans. The gradual rollout of information ensures sustained interest in the weeks leading up to the RDNA 4 debut.

What’s Next?

The teased design of the PULSE graphics card reinforces Sapphire’s reputation for crafting durable and efficient GPU solutions. As AMD’s RDNA 4 release date approaches, enthusiasts can expect more detailed announcements, including specifications, pricing, and availability for the Radeon RX 9000-series lineup. For now, Sapphire’s teaser hints at a strong showing in the next generation of graphics technology.

Sources: Sapphire Technology Tweet, VideoCardz, TechPowerUP

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Gigabyte RX 9070 XT Gaming OC Retail Listing Surfaces

A new leak has revealed a product listing for the Radeon RX 9070 XT from a retailer based in the Philippines. The model in question is the Gigabyte Gaming OC variant, featuring base and boost clock speeds of 2,400 MHz and 2,970 MHz, respectively. The card is equipped with 16 GB of GDDR6 memory running on a 256-bit memory bus. Additionally, the GPU features 4,096 shading units and 64 ray-tracing cores, aligning with earlier rumors about the RX 9070 XT’s technical specifications.

Pricing Breakdown and Market Positioning

The retail listing places the price of the RX 9070 XT Gaming OC at 35,000 Philippine Pesos, including a 12% value-added tax. This translates to approximately $521 before taxes, potentially making the card an attractive option in the U.S. market if similar pricing structures are adopted. Comparatively, leaks have suggested that the NVIDIA GeForce RTX 5070 will retail for higher, giving AMD’s offering an edge in terms of affordability.

Whether the AMD Radeon RX 9070 XT delivers value at this price point will ultimately depend on its real-world performance and how it stacks up against NVIDIA’s mid-range lineup. AMD’s strategy to undercut NVIDIA could help the company secure a larger share of the market, particularly if performance gains from RDNA 4 meet or exceed expectations.

Potential Concerns and Listing Accuracy

Despite the promising pricing, the accuracy of the leaked listing remains uncertain. The retailer’s page reportedly contains several typographical errors, casting doubt on the reliability of the information. However, these mistakes may simply reflect the early nature of the product’s release rather than deliberate inaccuracies. As a result, it remains unclear whether the pricing and specifications will hold true once the AMD Radeon RX 9070 XT officially launches.

Context and Competition

The AMD Radeon RX 9070 XT appears to be AMD’s attempt to dominate the mid-range GPU segment by combining competitive pricing with solid specifications. The inclusion of 16 GB of GDDR6 memory and a robust ray-tracing core count suggests a focus on high-resolution gaming and enhanced visual effects. Additionally, the use of a 256-bit memory bus may provide ample bandwidth for demanding applications, positioning the RX 9070 XT as a capable choice for both gamers and content creators.

NVIDIA’s GeForce RTX 5070, expected to feature the company’s latest Ada Lovelace successor architecture, will likely compete directly with the RX 9070 XT. The price differential between the two models could influence purchasing decisions, particularly in budget-conscious markets.

Our Verdict

The leaked retail listing of the Gigabyte RX 9070 XT Gaming OC suggests that AMD is prepared to offer a compelling mid-range GPU option at a competitive price. While the specifications and pricing are promising, the accuracy of the listing and the GPU’s real-world performance remains to be seen. With both AMD and NVIDIA vying for dominance in the mid-range market, the coming months are poised to bring intense competition and potentially more accessible options for gamers and PC enthusiasts.

As always, official announcements and independent reviews will be critical in assessing whether the RX 9070 XT lives up to its potential. For now, the leaked information paints a promising picture, but questions remain until the product becomes widely available.

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Shift in Strategy

In a notable departure from previous strategies, AMD has revised its nomenclature for gaming GPUs, reflecting a tactical retreat from the enthusiast graphics segment. The company’s focus now rests on delivering competitive performance within the broader performance market. According to AMD’s positioning, the Radeon RX 9070 XT will deliver performance comparable to the previous-generation Radeon RX 7900 XT in traditional rasterization tasks, while the RX 9070 will slightly outperform the RX 7800 XT. Meanwhile, the Radeon RX 9060 XT and RX 9060 will aim to outclass the RX 7700 XT and RX 7600 XT, respectively.

This strategy aligns the RX 9070 series against NVIDIA’s existing GeForce RTX 4000 lineup and the anticipated GeForce RTX 5000 series, signaling AMD’s commitment to maintaining relevance in a highly dynamic market.

RDNA 4: What’s New

The RDNA 4 architecture underpins the new Radeon RX 9070 series and promises significant advancements in several key areas:

• Enhanced SIMD Performance: AMD claims a substantial generational improvement in the performance of the SIMD (Single Instruction, Multiple Data) units within the RDNA 4 compute units.
• 2nd Gen AI Accelerators: The new AI accelerators are expected to deliver notable performance gains, enabling advanced features such as image generation, document summarization, and linguistic tasks through an application called AMD Adrenalin AI. This tool will also serve as an interactive assistant for AMD-related queries, functioning as a counterpart to NVIDIA’s Chat RTX.
• 3rd Gen Ray Accelerators: AMD’s updated ray-tracing hardware aims to reduce the computational overhead of ray tracing by shifting more workload to dedicated ray-tracing cores, freeing up the SIMD units for other tasks.
• Media and Display Enhancements: The new GPUs are set to introduce improved media encoding and decoding capabilities, as well as expanded support for advanced display interfaces.

FidelityFX Super Resolution 4

AMD also unveiled FidelityFX Super Resolution 4 (FSR 4), designed specifically for RDNA 4 GPUs. This iteration introduces machine-learning-based upscaling to deliver higher-quality visuals while maintaining performance. FSR 4 will include Frame Generation technology and an updated Anti-Lag 2 feature for smoother gaming experiences. One of the first games to support FSR 4 will be Call of Duty: Black Ops 6, highlighting AMD’s close partnerships with game developers.

Partner Support and AIB Lineup

AMD’s board partners are ready to launch custom Radeon RX 9070 series models, ensuring a variety of designs and cooling solutions for gamers. Partners include Acer, ASRock, ASUS, GIGABYTE, Sapphire, PowerColor, XFX, Vastarmor, and Yeston. However, MSI, a long-time AMD partner, appears to have exited the AMD graphics card ecosystem, leaving a noticeable gap in the lineup.

First Look at the “Navi 48” GPU

The Radeon RX 9070 series will be powered by the “Navi 48” GPU, which has been revealed to feature a unique rectangular die with a 2:1 aspect ratio. This design supports the theory that “Navi 48” consists of two “Navi 44” dies fused together with full cache coherency. The “Navi 48” GPU is expected to feature a 256-bit GDDR6 memory interface and 64 compute units (4,096 stream processors). In contrast, the smaller “Navi 44” GPU will offer half these specifications, with a 128-bit GDDR6 interface and 32 compute units.

Both GPUs will be manufactured using TSMC’s N4P (4 nm EUV) process node, which AMD is utilizing across its current product lineup, including mobile processors and CPU chipsets.

Closing Thoughts

AMD’s Radeon RX 9070 XT and RX 9070 represent a calculated move to solidify the company’s position in the performance GPU segment. With RDNA 4 architecture bringing significant advancements in ray tracing, AI acceleration, and media capabilities, AMD is positioning itself as a strong contender against NVIDIA’s upcoming offerings. As the first quarter of 2025 approaches, the stage is set for an exciting battle in the GPU market.

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Technical Overview

The Ryzen 9 9950X3D features 16 cores and 32 threads, while the Ryzen 9 9900X3D offers 12 cores and 24 threads. Both processors use a dual-CCD (Core Complex Die) design, similar to the Ryzen 9 7000X3D series. However, AMD has made significant improvements in how the 3D V-Cache is implemented. Unlike the previous generation, the 3D V-Cache in the “Zen 5” architecture is positioned below the CCD rather than above it. This design change enables the CCD with 3D V-Cache to achieve clock speeds comparable to the CCD without it. This is a notable improvement over earlier models, where the presence of 3D V-Cache often led to slightly reduced clock speeds.

To further optimize performance, AMD has refined its OS scheduler software. The updated scheduler ensures that productivity applications can efficiently utilize both CCDs, while gaming workloads are directed to the CCD equipped with 3D V-Cache. This selective utilization aims to maximize performance across diverse tasks.

Specifications

The Ryzen 9 9950X3D has a base clock of 4.30 GHz and boosts up to 5.70 GHz, with a thermal design power (TDP) of 170 W. This marks a significant improvement in boost frequency compared to the Ryzen 7 9800X3D, which maxes out at 5.20 GHz. AMD positions the 9950X3D as the fastest gaming desktop processor in its lineup.

The Ryzen 9 9900X3D, on the other hand, offers a base clock of 4.40 GHz and a maximum boost clock of 5.50 GHz. While its CCD with 3D V-Cache has only six cores, its high clock speeds make it an attractive option for users seeking balanced performance in gaming and productivity tasks.

Performance Benchmarks

AMD reports that the Ryzen 9 9950X3D is, on average, 8% faster than its predecessor, the 7950X3D, in gaming workloads. It also outperforms the Intel Core Ultra 9 285K by 20% in gaming tests conducted across 40 titles. For productivity workloads, the 9950X3D delivers 13% higher performance than the 7950X3D and is 10% faster than the Core Ultra 9 285K in a range of benchmarked tasks.

AMD has yet to release first-party performance data for the Ryzen 9 9900X3D, but based on its specifications, it is expected to compete closely with the 9800X3D in gaming and deliver faster performance in multi-threaded productivity workloads than non-X3D Ryzen 9000 processors.

Market Position and Availability

AMD asserts that the Ryzen 9 9950X3D is the “world’s best processor” for both gaming and productivity, a claim that underscores its aim to maintain a competitive edge against Intel’s latest offerings. The 9900X3D is expected to appeal to users seeking a more affordable yet high-performance option within the Ryzen 9000X3D lineup.

Both processors are scheduled for release in Q1 2025, with further details on pricing and availability expected to follow in the coming months. These additions to AMD’s portfolio demonstrate the company’s commitment to advancing desktop processor technology, leveraging innovations in cache design and microarchitecture to deliver higher performance and efficiency.

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Advanced Features in the B850 Series

ROG Strix B850 Motherboards: Performance and Style

The ROG Strix B850 series is aimed at gamers seeking high performance and advanced connectivity. Leading the pack is the ROG Strix B850-E Gaming WiFi, featuring a robust 16+2+2 VRM design, an 8-layer PCB for signal integrity, and tools like Dynamic OC Switcher for overclocking enthusiasts. It includes two PCIe 5.0 M.2 slots, a PCIe 5.0 x16 slot, WiFi 7 connectivity, and a 5G Ethernet port. Additionally, it offers USB4 and USB 20 Gbps Type-C ports, with fast-charging support for up to 30 watts.

The ROG Strix B850-F Gaming WiFi provides a more accessible option, omitting some premium features like USB4 and additional M.2 slots while still supporting PCIe 5.0 SSDs and GPUs. The ROG Strix B850-A Gaming WiFi adds a distinctive aesthetic with its white and silver color scheme, making it a standout choice for builders creating visually unique systems.

For compact builds, the ROG Strix B850-I Gaming WiFi Mini-ITX motherboard delivers top-tier performance in a small form factor. Despite its size, it supports up to 96GB of DDR5 RAM, two PCIe 5.0 M.2 slots, and features active VRM cooling for stable operation in cramped cases.

TUF Gaming B850 Motherboards: Essential Durability

TUF Gaming B850 motherboards focus on core gaming features and durability. With military-grade components, these boards are built to withstand harsh conditions, boasting extended lifespans and resistance to corrosion. The TUF Gaming B850-Plus WiFi offers PCIe 5.0 compatibility, WiFi 7, and ten USB ports, including USB 20 Gbps Type-C. It also features build-friendly enhancements like the PCIe Slot Q-Release and M.2 Q-Latch systems for easy installation and removal.

For smaller setups, the TUF Gaming B850M-Plus WiFi and TUF Gaming B850M-Plus bring similar features to the microATX form factor, providing efficient performance with 14+2+1 power stages and ample connectivity options.

Efficient and Affordable B840 Series

The B840 series caters to users who are building cost-effective PCs. These motherboards are ideal for systems centered on AMD Ryzen processors with integrated graphics, offering a balance of performance and energy efficiency. The initial B840 models belong to the Prime family, known for their reliability and straightforward design. While lacking PCIe 5.0 support, these boards provide ample connectivity and support for DDR5 memory, making them a practical choice for budget-conscious builders.

Enhanced BIOS and User Experience

ASUS continues to refine its BIOS interface, now offering a 1920 x 1080 resolution for improved clarity. The new Q-Dashboard provides a visual map of the motherboard layout, helping users locate components and connections easily. Additional support is offered through the ASUS AI Advisor, a software tool available for the B850, B840, and other ASUS motherboard series. This program provides detailed guidance on optimizing system performance and utilizing BIOS features effectively.

Upcoming X870E Series Models

In addition to the B850 and B840 announcements, ASUS teased two new X870E motherboards: the overclocking-focused ROG Crosshair X870E Apex and the flagship ROG Crosshair X870E Extreme. These models promise cutting-edge features for enthusiasts and are expected to launch within the first quarter.

Conclusion

The ASUS B850 and B840 series cater to a wide range of users, from gamers seeking top-tier performance to budget-conscious builders. With features like WiFi 7, PCIe 5.0 support, and enhanced BIOS tools, ASUS continues to innovate in the motherboard space. Whether building a high-performance gaming rig or an efficient workstation, these motherboards offer reliable options for modern AMD processors.

Specifications

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The processor features AMD’s refined cache architecture, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache, totaling 128 MB of L3 cache, alongside an additional 16 MB of L2 cache. Unlike its predecessor, the Ryzen 9 7950X3D, the new design incorporates a revamped CCD stacking method. The redesigned configuration positions the CCD above the cache, interfacing directly with the STIM (Soldered Thermal Interface Material) and IHS (Integrated Heat Spreader). This improvement eliminates thermal constraints that previously limited clock speeds on X3D chips, enabling higher operational frequencies.

The Ryzen 9 9950X3D features an asymmetric cache distribution across its dual CCDs. One CCD includes 32 MB of standard L3 cache paired with an additional 64 MB of stacked 3D V-Cache, while the second CCD contains a standard 32 MB L3 cache. This design allows the processor to optimize performance for gaming and productivity workloads while maintaining an efficient thermal profile.

The processor achieves a maximum boost clock of 5.65 GHz across both CCDs, matching the performance of non-X3D variants. Maintaining a 170 W TDP, the Ryzen 9 9950X3D demonstrates improved thermal efficiency despite the additional cache layer. AMD’s software-based OS scheduler remains a crucial component of the design, ensuring gaming workloads are directed to the CCD equipped with 3D V-Cache for optimal performance.

Preliminary performance leaks suggest that the Ryzen 9 9950X3D matches the base Ryzen 9 9950X in Cinebench R23 scores for both single-threaded and multi-threaded benchmarks. This is a notable improvement compared to the Ryzen 9 7950X3D, which exhibited lower performance than its non-X3D counterpart due to frequency limitations imposed by its thermal constraints. These results indicate AMD has successfully mitigated the challenges associated with integrating 3D V-Cache on high-core-count processors.

AMD’s plans for the Zen 5 X3D lineup include the Ryzen 9 9950X3D as well as the 12-core Ryzen 9 9900X3D, both expected to launch in the first quarter of 2025. Full performance benchmarks, pricing, and additional details are anticipated at CES 2025, where AMD is expected to officially unveil the new processors. The event will also mark the debut of AMD’s next-generation RDNA 4 GPUs, further highlighting the company’s advancements in high-performance computing.

Sources: @94G8LA, via VideoCardz

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Despite their similarities to the BD790i series, the new motherboards include a series of physical adjustments and features aimed at enhancing flexibility for different use cases. Both models support DDR5 SODIMM memory with speeds up to 5200 MT/s and a maximum capacity of 96 GB. They also feature two M.2 2280 SSD slots, one of which supports PCIe 5.0 for faster storage options, and a full-size PCIe 5.0 x16 slot for those who want to integrate a dedicated GPU.

Custom Cooling Options and Cost Savings

The BD795M model stands out for its omission of an included CPU cooler, giving users the freedom to choose their preferred cooling solution. This approach not only offers flexibility but also reduces the overall cost of the motherboard. Additionally, the board features an AIO pump connector, making it compatible with liquid cooling solutions, in addition to traditional air cooling. The CPU’s thermal design power (TDP) is rated at 100 W but can handle up to 120 W, ensuring adequate performance headroom for demanding applications.

However, some features present in the BD790i series have been scaled back in the BD795M. This model lacks an SSD heatsink and an SSD fan connector but compensates with an internal antenna adapter, maintaining a balance between cost and functionality.

Affordable High-Performance Options

The Minisforum BD795i SE, a Mini-ITX option, is largely identical to the BD795M but targets users with a preference for compact builds. Both models are priced competitively, with the BD795M available at $479 and the BD795i SE priced at $463 as part of a promotional offer. Minisforum has indicated that the price of the BD795i SE may increase after the promotional period ends.

These new additions to the Minisforum lineup are expected to appeal to users seeking high-performance systems at more accessible price points. The inclusion of features like PCIe 5.0 support and compatibility with a wide range of cooling solutions further enhances their versatility for different computing scenarios.

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AMD B850 Live Mixer Wi-Fi: Features and Specifications

The ASRock B850 Live Mixer Wi-Fi is an ATX motherboard designed for AMD’s B850 chipset. This chipset serves as a refresh of the popular B650, offering out-of-the-box support for AMD’s Ryzen 9000 series processors, including the high-performance 9000X3D series. The board is equipped with three M.2 NVMe slots for storage expansion. One of these slots supports PCIe Gen 5 speeds, while the remaining two are Gen 4. This configuration ensures ample storage flexibility for gaming and productivity setups.

In terms of connectivity, the B850 Live Mixer Wi-Fi is expected to include Wi-Fi 6E for high-speed wireless networking. The onboard audio solution utilizes codecs like the Realtek ALC1200 or ALC4080, providing a functional but unremarkable sound experience. There are no advanced amplifier circuits or premium audio components typically seen in higher-end motherboards, indicating its mid-range positioning.

Intel B860 Live Mixer Wi-Fi: Key Highlights

The Intel B860 Live Mixer Wi-Fi is another addition to the series, featuring the LGA1851 socket and the Intel B860 chipset. This board targets Intel’s upcoming “Arrow Lake” processors, continuing the trend set by the B760 chipset. As with its AMD counterpart, the B860 Live Mixer Wi-Fi lacks CPU overclocking capabilities, a common limitation of mid-range Intel chipsets.

The motherboard’s layout closely resembles the B850 Live Mixer Wi-Fi, making them visually similar aside from the CPU socket. It also offers three M.2 NVMe slots, with one supporting PCIe Gen 5 speed without compromising the x16 PEG slot’s bandwidth. The inclusion of Wi-Fi 6E is expected, ensuring modern wireless connectivity options. This consistency across the lineup highlights ASRock’s effort to deliver a balanced feature set for both AMD and Intel platforms.

B860M Live Mixer Wi-Fi: Compact Yet Versatile

For users seeking a smaller form factor, ASRock introduces the B860M Live Mixer Wi-Fi. This Micro-ATX motherboard retains most features of its full-sized sibling but incorporates a few adjustments. The third M.2 slot lacks a heatsink, and the second PCIe slot is physically x8 but electrically x4, which aligns with the practical requirements of most users. Despite its reduced size, the B860M Live Mixer Wi-Fi remains a strong contender for compact PC builds.

Availability and Launch Timeline

Both AMD and Intel are expected to unveil their respective B850 and B860 chipsets in January, with ASRock likely timing the launch of the Live Mixer series to coincide with these announcements. The boards’ combination of modern features, mid-range pricing, and unique design positions them as appealing options for gamers and system builders looking to adopt the latest technologies without venturing into the high-end segment.

ASRock’s Live Mixer series continues the company’s tradition of offering diverse motherboard solutions tailored to a wide range of users. As more details emerge closer to the official launch, these boards are poised to capture attention in the competitive mid-range motherboard market.

Source: momomo_us (Twitter)

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